Tag: Teledyne

Building on the services that were initially announced back in late 2019, the company is now expanding the scope of these to encompass several key additional elements. Consequently, multifaceted services are now available to design teams for increasing design margins when implementing high-performance multi-core processors.

The company has successfully demonstrated next generation data converter technology that its engineering team is currently in the process of testing.

Teledyne e2v is moving ever closer to its goal of bringing about a major overhaul of the signal chain – through the availability of its latest performance-redefining digital-to-analog converters (DACs).

These results complement those previously obtained in terms of single event latch-up (SEL) and single event upset (SEU) when exposed to heavy-ions up to more than 60MeV.cm²/mg.

These engineering advances relate specifically to the accompanying data storage, data processing and data conversion elements.

Furthermore, high-reliability manufacturing and radiation-tolerant robustness makes it highly suitable for dealing with the rigors of space environments.

Teledyne e2v is set to further expand its portfolio of digital-to-analog converter (DAC) ICs and through availability of an accompanying evaluation platform, engineers will be able to begin applying it to their design projects soon.

In response to the ongoing advances in programmable logic technology, Teledyne e2v has made further enhancements to its portfolio of data converters, along with the high-speed SERDES technology that supports them.

As a longstanding supplier to the European Space Agency (ESA), NASA, ESO, and JAXA, e2v understands well the required diligence of delivering science-level visible detection to an environment where detectors and systems simply must work.

Teledyne e2v marks this anniversary with a series of publications and highlights how the future is bright for CCDs in space, science and other demanding applications.

Teledyne e2v and partner Emerges, will be at booth B11, displaying high reliability, feature-rich semiconductor products, which enable demanding aerospace and defense applications.

In a recent safety-critical aerospace customer project, Teledyne e2v was able to deliver T1042 multi-core microprocessors for which the power consumption was almost 50% lower on the final application — thereby dramatically reducing the constraints placed on the overall system.

Please visit Teledyne e2v on booth B32 to find out more about its high reliability semiconductor and microwave solutions to address demanding aerospace and defense applications.